Secure your place at the Total Supply Chain Summit - Last Call! - Total Supply Chain Summit | Forum Events Ltd
  • Sparck Technologies
    Sparck Technologies
  • Secure your place at the Total Supply Chain Summit – Last Call!

    Total Supply Chain Summit

    We have just three places remaining for next month’s Total Supply Chain Summit, which takes place on May 21st & 22nd at  Heythrop Park, Oxfordshire.

    It is free for you to attend – are you able to join us?

    Register now as these last places will go quickly. Simply click here and complete the form.

    Benefits for attending delegates include:

    • Source innovative and budget-saving suppliers
    • Network with like-minded peers
    • Enjoy full hospitality, including lunch, all refreshments, a gala dinner and overnight accommodation

    In addition, you will have the opportunity to attend a series of free seminar sessions. Topics include:

    • Ensure competent staff in Logistics and Supply Chain Management – Nicole Geerkens, Executive Director, Europeans Logistics Association
    • Increasing field service efficiency – Grant Jones, Business Development Director, TVS Supply Chain Solutions
    • Procurement: Frustration or Facilitation? – Tony Morris, Procurement Consultant, Dataction
    • ISO9001:2015: The Challenges, Impacts & Benefits – Paul Hastings, Account Manager, Ideagen
    • Ultra-Low Emission Vehicles: The Procurement Conundrum – Peter Eldridge, Director, ICFM
    • Empowering your supply chain with smart technology – David Mudd, Director, IoT Business Development, BSI – British Standards Institution

    To find out more about attending as a delegate, contact Jamie Higgs on 01992 374058 / j.higgs@forumevents.co.uk.

    Alternatively, if you’re an industry supplier and would like to showcase your products and services at the event, contact Nick Stannard on 01992 374092 / n.stannard@forumevents.co.uk.

    AUTHOR

    Stuart O'Brien

    All stories by: Stuart O'Brien

    Leave a Reply

    Your email address will not be published.